In a 1965 paper, Intel co-founder Gordon E. Moore predicted that the number of transistors on an integrated circuit would double approximately every two years. This prediction has proven to be uncannily accurate over the years and has come to be known as Moore’s Law. But it’s not going to hold true forever, is it? Well, it’s believed that like all things good, Moore’s Law too will come to an end one day. The question that remains, though, is when. Noted theoretical (and often theatrical) physicist Michio Kaku feels he has the answer.

Kaku believes the days of Moore’s Law are numbered, and foresees its demise in around 10 years or so. Like many others, he feels it’s becoming increasingly difficult for us to sustain this exponential growth using just traditional silicon-based computing. According to the theoretical physicist, who is a co-founder of the string field theory, even three-dimensional chips like the ones recently introduced by Intel aren’t going to be of much help due to problems like leakage and heat.

“So, what’s beyond silicon?” Kaku asks in a recent BigThink.com video. “There have been a number of proposals: protein computers, DNA computers, optical computers, quantum computers, molecular computers.”

“If I were to put money on the table, I would say that in the next ten years we’ll simply tweak Moore’s Law a bit with chip-like computers in three dimensions, but beyond that we may have to go to molecular computers and perhaps late in the 21st century quantum computers.”

Image Credit: Murketing

Last month, Dell revamped its Alienware notebook range, which includes the 18.4-inch M18x R2, 17.3-inch M17x R4 and the 14-inch M14x R2. But with Dell’s 2012 Alienware notebook lineup debuting a month ahead of Ivy Bridge’s launch, the new notebooks only featured Sandy Bridge parts at launch. That has now changed, with Dell on Monday announcing the availability of the M18x R2, M17x R4 and M14x R2 with 3rd generation Intel Core i processors.

The entire range has been moved to Ivy Bridge, with the exception of the M14x, which still comes with a 2nd generation Core i5 if one opts for the most basic model. The various processor options available with each model are as follows:

• Alienware M14x: Core i5-2450M 2.5GHz (3.1GHz w/Turbo Boost, 3MB Cache), Core i7-3610QM 2.3GHz (3.3GHz w/Turbo Boost, 6MB Cache), Core i7-3720QM 2.6GHz (3.6GHz w/Turbo Boost, 6MB Cache) and Core i7-3820QM 2.7GHz (3.7GHz w/Turbo Boost, 8MB Cache).
• Alienware M17x: Core i7-3610QM 2.3GHz (3.3GHz w/Turbo Boost, 6MB Cache), Core i7-3720QM 2.6GHz (3.6GHz w/Turbo Boost, 6MB Cache) and Core i7-3820QM 2.7GHz (3.7GHz w/Turbo Boost, 8MB Cache).
• Alienware M18x: Core i7-3610QM 2.3GHz (3.3GHz w/Turbo Boost, 6MB Cache), Core i7-3720QM 2.6GHz (3.6GHz w/Turbo Boost, 6MB Cache), Core i7-3820QM 2.7GHz (3.7GHz w/Turbo Boost, 8MB Cache), Core i7-3920XM 2.9GHz (3.8GHz w/Turbo Boost, 8MB Cache) and Core i7-3920XM Overclocked Turbo Boost (8MB Cache).

The good news is that the prices of the various models in the 2012 Alienware notebook range remain unaffected by the introduction of Ivy Bridge chips and the M14x, M17x and M18x still start at $1,100, $1,400 and $1,700, respectively.

SAN DIEGO, USA: Ethertronics, a leading technology company enabling innovative antenna and RF solutions to deliver the best connected experience, today announced Ethertronics Double Shot Molding technology. This advanced manufacturing technique enables device OEMs to leverage the trend toward ultra-thin smartphones and tablets by minimizing the amount of space required for antennas.

Conventional double-shot manufacturing techniques produce antennas that are 1 mm thick. Ethertronics’ Double Shot Molding technology reduces the antenna’s thickness to 0.8 mm, freeing up space for more components in the mechanical stack-up – all with no performance tradeoffs and at a cost comparable to conventional manufacturing techniques. This equates to a volume reduction of 15 percent in a conventional form factor for the antenna’s space.

Ethertronics’ Double Shot Molding solution also allows complex 3D antenna designs, including radius curvatures, to maximize the limited amount of space available inside today’s increasingly slender smartphones and tablets. This flexibility enables OEMs to create innovative form factors that stand out in the marketplace without compromising performance.

“Our advanced Double Shot Molding technology gives device OEMs a convenient, cost-effective way to meet operator and customer demands for compact, high-performance tablets and smartphones,” said Sung Ki Jung, VP of advanced mobile technology and GM of Korea at Ethertronics. “No other commercial manufacturing technique provides Double Shot Molding’s combination of cost, performance, and design flexibility. This technology is the latest example of how Ethertronics gives OEMs the solutions they need to stay competitive.”

Ethertronics’ double shot molding technology is more than just a manufacturing breakthrough. This technique is the next step in Ethertronics’ evolution to an active antenna and RF system company by enabling the integration of more components within the volume of the antenna – offering greater flexibility in terms of vertical integration.

Antennas utilizing Ethertronics’ Double Shot Molding technique are immediately available to OEMs, with commercial wireless devices expected to hit the market in the first half of 2012.

DURHAM, USA: LED lighting leader Cree Inc. announced the addition of TEMPO 24 to its comprehensive suite of Cree Services for LED luminaires. The new TEMPO (Thermal Electrical Mechanical Photometric Optical) 24 service combines IES LM-79-08 photometric testing with an extensive set of LED performance tests that surpasses all industry testing parameters and can help ensure total system design and quality.

The Cree Durham Technology Center has been accredited by The National Voluntary Laboratory Accreditation Program (NVLAP) and furthers Cree’s commitment to helping LED manufacturers overcome design challenges and bring quality products to market faster.

“LM-79 is a necessary test and has become a requirement for doing business in the Solid State Lighting market,” said Mark McClear, director of global applications engineering, Cree. “TEMPO 24 includes a fully accredited LM-79 test, but goes well beyond this or any currently existing standards. Cree has identified through our years of SSL experience nearly a dozen other potential problem sources of LED luminaire design. Our goal is the same as our customers – and their customers as well – quality SSL products that save energy. TEMPO 24 helps ensure this and gives customers the information they need to design and specify an SSL product with confidence.”

“In my experience, if I had to select a single document that’s had the greatest impact in selling LED light sources to customers, it would be the Cree TEMPO report,” said Pierre van Helden, CEO, LED Lighting SA. “The service provided an independent and thorough review for our products and the results give us the confidence to sell our products with passion—giving our customers the assurance that our products are being designed and produced to the highest international standards.”

TEMPO 24 provides LED luminaire tests that are not offered by any other third-party testing facility. In addition to LM-79 testing which is an approved method for taking electrical and photometric measurements, TEMPO 24 testing includes binning and color point evaluation, chemical compatibility and TM-21 lifetime projection. TEMPO 24 examines all aspects of an LED design and provides customers a true assessment of luminaire performance that can be used to promote and distinguish their product. Every TEMPO service delivers an accurate, easy-to-understand TEMPO report that includes all testing results and relevant performance data.

Cree’s Durham Technology Center NVLAP accreditation (NVLAP lab code 500070-0) ensures that TEMPO measurements are performed according to the Illuminating Engineering Society (IES) approved method for the electrical and photometric measurements of LED lighting – delivering lighting manufacturers consistent, accurate and repeatable measurements for luminaires. NVLAP accreditation signifies that a laboratory has demonstrated it operates in accordance with NVLAP management and technical requirements pertaining to quality systems, personnel, accommodation and environment, test and calibration methods, equipment, measurement tractability, sampling, handling of tests and calibration items, and test and calibration reports.

Cree laboratories also work to American National Standards Institute (ANSI) and National Institute of Standards and Technology (NIST) requirements.

LISLE, USA: Molex Inc.’s SolarSpec panel-mount DC connectors are now fully certified to applicable IEC standards and endorsed by the TUV and UL approval agencies. The SolarSpec panel-mount DC connectors, with an internal locking and touch-proof design for superior safety, feature a retention nut mechanism for simple assembly to the panel and provide a secure and reliable cable connection for internal inverter wiring. Production volumes of the panel mount connector are now available from Molex and its distribution channels.

“The panel-mount DC Connector for solar inverters complements the SolarSpec portfolio, which now includes a junction box for silicon photovoltaic panels, crimp terminal DC connectors for direct attachment to solar junction boxes, field installations and photovoltaic grid wiring and DC cable assemblies,” says Peter Commane, product manager, Molex. “In-house design and manufacture of SolarSpec components ensure high quality levels and reliability—at a competitive price. Customers also benefit from exclusive value-added design features.”

The IEC, NEC 2008 (690.33) and NFPA 70 US code-compliant SolarSpec solution offers an innovative interlocking mechanism that protects against accidental and unauthorized decoupling of the connector during field application and provides for reliable connection and safe handling. Offering exceptional efficiency, the contact resistance of the SolarSpec panel-mount DC Connector remains below 0.5 milliohms.

The connector can handle as much as 30.0A and accommodates 2.50mm2 and 4.00 to 6.00mm2 (14 AWG and 12 to 10 AWG) cable to meet a wide range of customer requirements. Polarized panel cut-outs help prevent rotation of the connectors and ensure no cross-assembly of male and female connectors when applied to the bulkhead panel.

Rugged SolarSpec panel-mount DC Connectors are IP67-sealed to protect against the ingress of dust and water. The housing body is resistant to UV and ozone damage. The touch-proof safety design protects installers and maintenance engineers from electrical current even during mating and decoupling operations. The connectors feature exclusive molded surface ribs to allow secure gripping, especially while wearing work gloves.

For ease of assembly, a simple nut mechanism on the SolarSpec panel-mount DC Connector is tightened using a standard wrench to secure it onto the bulkhead of the inverter panel. For additional security, a Molex field service tool is required to disengage the latch when unplugging. Another attractive feature is that the same Molex application tooling is suitable for both the panel mount and standard DC crimp terminals. This includes the hand crimp tool and the Mini-Mac bench applicator.